Compact Platinum Sensors for Precise Temperature Measurement
SMDs & FlipChips
SMDs & FlipChips
As electronic devices become smaller, smarter, and more densely integrated, temperature sensing solutions must deliver exceptional performance within an increasingly limited footprint. Our FlipChip RTD portfolio addresses this demand by combining proven platinum thin-film technology with compact designs optimized for automated PCB assembly.
Designed for high-volume manufacturing, iST's FlipChip sensors offer excellent long-term stability, low self-heating, fast response times, and an attractive price-performance ratio. Available in multiple chip sizes and pad configurations, these sensors provide engineers with the flexibility to select the ideal solution for their application.
iST’s SMD RTD portfolio offers standard package sizes with various resistance values and tolerance classes to meet different application requirements. While the 2ST is optimized for standard PCB temperature monitoring up to 150 °C, the 4ST supports temperatures up to 250 °C, making it ideal for demanding applications such as power electronics, industrial automation, and automotive systems. With high thermal durability, SMT compatibility, flexible packaging options, and excellent long-term stability, the 4ST provides reliable temperature measurement in environments where conventional SMD RTDs may not perform adequately.
How do I select the right sensor for my application?
- Smallest footprint: 0402 3FC
- Balanced performance and handling: 0603 3FC
- Enhanced robustness: 0805 3FC
- Advanced assembly flexibility: 0805 FC2
- High-temperature PCB monitoring: 4ST
- Extreme miniaturization and customization: Pt-on-Silicon or BondSens
FlipChip RTDs: Compact Pt sensors for precise temperature measurement
0402 3FC: Maximum performance in minimal space
The 0402 3FC is the most compact member of the FlipChip family, making it the ideal choice for applications where board space is at a premium. Despite its miniature size of just 1.0 × 0.45 mm, the sensor delivers reliable and accurate temperature measurement while enabling high-density electronic designs.
Key advantages include:
- Ultra-small footprint for space-constrained applications
- Bondable and solderable thin-film gold pads
- Automated assembly compatibility
- Pt1000 resistance
- Operating temperatures from -50 °C to +250 °C
Typical applications include wearable devices, portable or on-skin medical equipment, compact industrial electronics, miniscule probes, and battery monitoring systems where every millimeter counts.
0603 3FC: The versatile high-class allrounder
The 0603 3FC provides an excellent balance between size, handling, and measurement performance. Available with Pt100 and Pt1000 nominal resistances, it supports IEC 60751 accuracy classes F0.15 and F0.3, making it suitable for a wide range of precision temperature measurement tasks.
Benefits include:
- Compact design with improved handling during assembly
- Available in class A: High accuracy according to IEC 60751
- Bondable and solderable gold pad technology
- Excellent long-term stability
- Flexible resistance and tolerance class options
This sensor is particularly well-suited for industrial controls, laboratory instrumentation, HVAC systems, and medical devices requiring precise thermal monitoring.
0805 3FC: Enhanced robustness and accuracy
For applications where larger dimensions are acceptable and handling robustness is especially important, the 0805 3FC offers an attractive solution. Available in both Pt100 and Pt1000 versions,it supports IEC 60751 accuracy classes F0.15, and the sensor maintains the same high-quality platinum thin-film technology while providing a larger mounting area.
Benefits & characteristics include:
- Bondable and solderable thin-film gold pads
- Available in class A: High accuracy according to IEC 60751
- Reliable long-term stability
- Fast thermal response
- Suitable for automated mass production
The 0805 3FC is commonly selected for industrial automation, power electronics, heating systems, and process control equipment.
0805 FC2: Expanded assembly possibilities
For customers seeking advanced assembly options, iST offers the 0805 FC2 variant. While retaining the compact 0805 footprint and excellent RTD performance, the FC2 introduces thick-film gold pads that are not only solderable and bondable but also sinterable. This additional capability opens new possibilities for innovative packaging concepts and demanding industrial applications.
The FC2 benefits include:
- Solderable, bondable, and sinterable pad technology
- Increased process flexibility
- Reliable operation from -50 °C to +250 °C
- Available in Pt100 and Pt1000 versions
- High-volume manufacturing compatibility
This makes the FC2 particularly attractive for power modules, advanced electronics packaging, automotive systems, and next-generation sensor integration concepts.
One platform, multiple options
Across the entire FlipChip portfolio, engineers benefit from common advantages:
- Platinum thin-film RTD technology
- Excellent long-term stability with minimal drift
- Low self-heating characteristics
- Fast response times
- Automated pick-and-place compatibility
- REACH and RoHS compliance
- Temperature capability up to +250 °C
Find the perfect fit for your design
Whether your priority is minimizing PCB space, maximizing assembly flexibility, or achieving the highest measurement accuracy, iST's FlipChip family offers a solution tailored to your requirements. From the miniature 0402 3FC to the highly versatile 0805 FC2, these sensors enable reliable and precise temperature monitoring across a broad range of industries and applications.
With their combination of Swiss precision, manufacturing efficiency, and design flexibility, iST FlipChip RTDs help engineers meet today's thermal measurement challenges while preparing for tomorrow's innovations.
SMD platinum RTD – designed for reliable temperature measurement in automated electronics Manufacturing
Our SMD portfolio consists of all standard sized SMDs with different tolerance classes and resistance to choose from. While the 2ST is an excellent choice for standard PCB temperature monitoring up to 150 °C, the 4ST extends the operating range to 250 °C, making it the ideal solution for next-generation power electronics, industrial controls, automotive systems, and other high-temperature applications. With superior thermal robustness, multiple package options, automated SMT compatibility, and exceptional long-term stability, the 4ST delivers reliable temperature measurement where conventional SMD RTDs reach their limits.
SMD 2ST for the automatic assembling on PCBs
The SMD 2ST is a compact, reliable temperature sensor for automated PCB assembly. Available in 0603, 0805, and 1206 sizes, it provides stable measurement from -50 °C to +150 °C with a TCR of 3850 ppm/K and nominal resistances of 100 Ω, 500 Ω, or 1000 Ω at 0 °C.
Soft-termination tin-plated pads with a nickel barrier ensure robust soldering, while IEC 60751 tolerance classes F0.15, F0.3, and F0.6 offer flexibility for different accuracy needs. Supplied taped on reel or taped for samples, the sensor is easy to integrate into production and evaluation processes.
Benefits & characteristics
- Excellent long-term stability and thermal cycling
- Low self-heating
- Automatic assembly in large-volume applications
SMDs for high temperatures
High-temperature SMD sensors provide reliable temperature measurement in compact 0603, 0805, and 1206 formats. Designed for automated PCB assembly, they deliver stable performance from -50 °C to +250 °C with a TCR of 3850 ppm/K and nominal resistances of 100 Ω or 1000 Ω at 0 °C.
Soft-termination tin-plated pads with a nickel barrier ensure robust soldering, while IEC 60751 tolerance classes F0.15, F0.3, and F0.6 offer flexibility for different accuracy requirements. Supplied taped on reel or taped for samples, they are easy to handle in production and evaluation. sampling quantities.
Benefits & characteristics
- Excellent long-term stability
- Taped on reel Reel
- Automatic assembly in large-volume applications
- Low self-heating
- Fast response time
- For high temperature PCB applications
BondSens: Miniaturized Pt-sensor
Our smallest Pt1000 SMD is a bondable platinum 1000 Ω RTD component with a temperature range of -50° C to 150° C, taped on reel (sensor side up), with 0.1 x 0.2 mm (LxW) bondable contacts .
BondSens is designed for automatic placement in high volume applications on printed circuit boards where long term stability, interchangeability, combined with low cost are important. This RTD is typically used in energy management for thermal compensation, industrial and medical devices.
It features a very small size of 0.75mm x 0.75mm with very low drift and can be integrated within semiconductor devices. It is also designed for Au-wire bonding.
Customized adaptations are available on request
Is BondSens still too large? Try Pt-on-Si!
High-performance applications need compact temperature sensors that deliver accuracy, stability and reliable interchangeability in the smallest spaces. iST’s Pt-on-Si platform combines platinum thin-film reliability with silicon-based MEMS miniaturization.
The result: precise, stable and scalable temperature sensing for next-generation datacom, medical, optical, laser and semiconductor applications.
The platinum-on-Silicon platform
Multiparametric measurement on less 0.5 x 0.5 mm
At the core is a standard, qualified process flow for depositing reliable platinum layers on silicon substrates.
Around that core, iST adds standard MEMS process steps as each application requires – so customization happens
on a proven foundation rather than in an experimental one.
Miniaturization
Thin-film platinum patterned by photolithography allows high resistance values in very small areas. Up to 5 kΩ fits on 0.25 mm² of active area, and chip outlines below 0.5 × 0.5 mm² are achievable.
Design freedom
Silicon etching defines the outline, so the chip is not restricted to a rectangle. Rounded edges, through-holes for mounting or fluid contact, custom thicknesses and slim geometries are all part of the design space. Sensors can be combined with heaters, or integrated alongside other silicon chips.
Scalability
Because the platform runs on standard semiconductor equipment and assembly methods, the same design carries from first samples to volume production – with the cost curve that comes with it.
Custom-built for any application
Our Pt-on-Si-sensors are always custom-built to suit our customer's application dimentions. Talk to us about your requirements!