Thin-film platinum 100 Ohm RTD component
芯片尺寸/尺寸
2.3 x 2.0 x 1.05 mm
公差/等级
IEC 60751 F0.3 (IST AG tolerance class B)
152297
from CHF 2.58
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-50 °C to +200 °C, 1.6 x 1.2 mm, bondable Au-Pads, metallized backside. Its improved thermal conductivity makes it ideal for various applications in the semiconductor and microelectronics industries, medical devices, aerospace and defense, industrial instrumentation, e-mobility and automotive
芯片尺寸/尺寸
1.6 x 1.2 x 0.25 mm
公差/等级
IEC 60751 F0.3 (IST AG tolerance class B)
100797
from CHF 12.62