As electronic devices become smaller, smarter, and more densely integrated, temperature sensing solutions must deliver exceptional performance within an increasingly limited footprint. Our FlipChip RTD portfolio addresses this demand by combining proven platinum thin-film technology with compact designs optimized for automated PCB assembly.
Designed for high-volume manufacturing, iST's FlipChip sensors offer excellent long-term stability, low self-heating, fast response times, and an attractive price-performance ratio. Available in multiple chip sizes and pad configurations, these sensors provide engineers with the flexibility to select the ideal solution for their application.
0402 3FC: Maximum performance in minimal space
The 0402 3FC is the most compact member of the FlipChip family, making it the ideal choice for applications where board space is at a premium. Despite its miniature size of just 1.0 × 0.45 mm, the sensor delivers reliable and accurate temperature measurement while enabling high-density electronic designs.
Key advantages include:
- Ultra-small footprint for space-constrained applications
- Bondable and solderable thin-film gold pads
- Automated assembly compatibility
- Pt1000 resistance
- Operating temperatures from -50 °C to +250 °C
Typical applications include wearable devices, portable or on-skin medical equipment, compact industrial electronics, miniscule probes, and battery monitoring systems where every millimeter counts.
0603 3FC: The Versatile All-Rounder
The 0603 3FC provides an excellent balance between size, handling, and measurement performance. Available with Pt100 and Pt1000 nominal resistances, it supports IEC 60751 accuracy classes F0.15 and F0.3, making it suitable for a wide range of precision temperature measurement tasks.
Benefits include:
- Compact design with improved handling during assembly
- High measurement accuracy
- Bondable and solderable gold pad technology
- Excellent long-term stability
- Flexible resistance and tolerance class options
This sensor is particularly well-suited for industrial controls, laboratory instrumentation, HVAC systems, and medical devices requiring precise thermal monitoring.
0805 3FC: Enhanced Robustness and Accuracy
For applications where larger dimensions are acceptable and handling robustness is especially important, the 0805 3FC offers an attractive solution. Available in both Pt100 and Pt1000 versions, the sensor maintains the same high-quality platinum thin-film technology while providing a larger mounting area.
Features include:
- Bondable and solderable thin-film gold pads
- High accuracy according to IEC 60751
- Reliable long-term stability
- Fast thermal response
- Suitable for automated mass production
The 0805 3FC is commonly selected for industrial automation, power electronics, heating systems, and process control equipment.
0805 FC2: Expanded Assembly Possibilities
For customers seeking advanced assembly options, iST offers the 0805 FC2 variant. While retaining the compact 0805 footprint and excellent RTD performance, the FC2 introduces thick-film gold pads that are not only solderable and bondable but also sinterable. This additional capability opens new possibilities for innovative packaging concepts and demanding industrial applications.
The FC2 benefits include:
- Solderable, bondable, and sinterable pad technology
- Increased process flexibility
- Reliable operation from -50 °C to +250 °C
- Available in Pt100 and Pt1000 versions
- High-volume manufacturing compatibility
This makes the FC2 particularly attractive for power modules, advanced electronics packaging, automotive systems, and next-generation sensor integration concepts.
One Platform, Multiple Options
Across the entire FlipChip portfolio, engineers benefit from common advantages:
- Platinum thin-film RTD technology
- Excellent long-term stability with minimal drift
- Low self-heating characteristics
- Fast response times
- Automated pick-and-place compatibility
- REACH and RoHS compliance
- Temperature capability up to +250 °C
Find the Perfect Fit for Your Design
Whether your priority is minimizing PCB space, maximizing assembly flexibility, or achieving the highest measurement accuracy, iST's FlipChip family offers a solution tailored to your requirements. From the miniature 0402 3FC to the highly versatile 0805 FC2, these sensors enable reliable and precise temperature monitoring across a broad range of industries and applications.
With their combination of Swiss precision, manufacturing efficiency, and design flexibility, iST FlipChip RTDs help engineers meet today's thermal measurement challenges while preparing for tomorrow's innovations.