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-50 °C to +200 °C, 1.6 x 1.2 mm, bondable Au-Pads, metallized backside. Its improved thermal conductivity makes it ideal for various applications in the semiconductor and microelectronics industries, medical devices, aerospace and defense, industrial instrumentation, e-mobility and automotive

Chip size/dimensions
1.6 x 1.2 x 0.25 mm
Tolerance/class
IEC 60751 F0.3 (IST AG tolerance class B)
100797
from CHF 12.62

Temperature sensor, ESD-optimized, class A -200 °C to +600 °C, 2.4 x 1.4 mm, 10 mm wires for cryogenic applications

Chip size/dimensions
2.4 x 1.4 x 1.3 mm
Tolerance/class
IEC 60751 F0.15 (IST AG reference class A)
155863
from CHF 9.79